The short answer. Ten plants here build on metal, ceramic or heavy copper: Kinwong (metal-based MPCB and thick copper, with a second MPCB plant expanding), Kaishengshi (aluminium metal-core, 3 oz heavy copper, ceramic, car-lamp boards), Wanyexing (ceramic substrate and high-thermal-conductivity copper-core, 53 staff), Shengda Xinxing (aluminium-substrate specialist), Hong'an Xingsheng (aluminium metal-core plus FR4), Haiying (metal-core and carrier boards), Glorysky (oversized metal-backed laminate for LCD), Xunjiexing (heavy copper and metal-backed), Champion Asia (thick copper and ceramic in its annual report) and Puruisen (aluminium substrate in its registered scope).
The number that is missing. Thermal conductivity, in W/mK, is the single figure a buyer of these boards needs — and zero of sixteen publish it. Copper weight is published once (3 oz, Kaishengshi). This is a speciality sold on thermal performance, documented almost entirely by adjectives.
| Plant | Metal-core | Ceramic | Heavy copper | What else is published |
|---|---|---|---|---|
| Kinwong ¥15.31bn | MPCB / metal-based | — | Thick copper | Longchuan MPCB #2 expanding; no copper weight, no thermal figure |
| Kaishengshi Suining | Aluminium | Yes | 3 oz | 1,000,000 m²/year claimed; car-lamp, audio and lamp-bar boards; up to 10 layers |
| Wanyexing 53 insured staff | Copper-core, high thermal conductivity | Ceramic substrate | — | Claimed 5 µm machining tolerance; in-house gold immersion; 5–15 day quote |
| Shengda Xinxing Suining | Aluminium, 1–2 layer in volume | — | — | 32 mu; ¥10M+ single equipment refresh; 600,000 m²/year; no website |
| Hong'an Xingsheng Suining | Aluminium + FR4 | — | — | 3/3 mil line/space, 10:1 plating aspect ratio (vendor-stated); two conflicting capacity figures |
| Haiying Suining | Metal-core / carrier | — | — | 293 insured; 186 patents; 300,000 m²/year stated (government figure differs) |
| Glorysky ¥1.152bn | Metal-backed, oversized | — | — | Dedicated LCD line; names 华星光电, 友达, 群创, LGD; no capacity, no copper weight |
| Xunjiexing ¥689m | Metal-backed | — | Heavy copper | Prototype to volume; no copper weight, no thermal figure |
| Champion Asia ¥2.54bn | — | Ceramic boards | Thick copper | Product families per the 2025 annual report; no figures for either |
| Puruisen Suining | Aluminium (registered scope) | — | — | HDI with blind and buried vias; no copper weight |
They are different processes with one shared purpose: moving heat or current that a normal FR4 board cannot carry. A metal-core board is FR4 or a dielectric bonded to an aluminium (or copper) plate — the metal is a heat spreader and a stiffener, which is why it dominates LED lighting, automotive lamps and power conversion. A ceramic board (alumina, AlN) replaces the organic laminate entirely, for thermal conductivity an order of magnitude higher and for RF performance that FR4 cannot deliver; it is a small-volume, high-mix business. Heavy copper is the same FR4 process with 2–10 oz of copper on one or both sides, for current-carrying traces in power supplies and motor drives.
The buyer for all three is the same kind of company — lighting, power, automotive, RF — and the qualification questions converge on two numbers: how much heat the board moves (W/mK, or thermal resistance from junction to ambient in the finished assembly) and how much current the copper carries at the temperature rise your safety file allows. Neither number appears on any of the sixteen sites.
Thermal conductivity. Zero of sixteen. For a metal-core board this is a property of the dielectric layer (typically quoted in the range of 1–3 W/mK for standard thermally-conductive prepreg, higher for specialised products), and for a ceramic board it is a property of the substrate material. Without it, “high thermal conductivity” — Wanyexing’s phrase — is a category, not a specification.
Copper weight ceiling. One of sixteen. Kaishengshi publishes 3 oz. Every other plant claiming heavy copper — Kinwong, Xunjiexing, Champion Asia — publishes the phrase and not the number. Whether a plant can run 6 oz or 10 oz is the difference between a power board and a busbar.
Dielectric thickness and tolerance. Nobody publishes it anywhere. On a metal-core board this controls the thermal path and the voltage withstand at the same time, and it is the parameter that most often fails a safety file after the samples have passed.
The one plant that publishes a process number. Wanyexing claims a 5 µm machining tolerance on ceramic, an in-house gold-immersion line and names its base materials (Wangling, Shengyi). It is a 53-person plant and the only one here that gives a buyer something to check on the ceramic side — which says more about the industry’s documentation habits than about the other plants’ capability.
“Metal-backed” is sometimes about size, not heat. Glorysky’s metal-backed line exists to make oversized LCD boards dimensionally stable, not to dissipate power. If your requirement is thermal, ask what the dielectric is, not whether the board has metal in it.
Shengda Xinxing has no website at all. It is described in this directory as an aluminium-substrate specialist with 32 mu of land, a ¥10m+ equipment refresh and patents concentrated on handling and process hardware — and there is no page to check any of it on, no English material, and a name that three unrelated companies share. A buyer needs an intermediary or a visit.
Kaishengshi’s site is the least finished in the directory. Its meta description literally reads “website description”. The capability claims are specific and useful — 3 oz, aluminium, ceramic, car-lamp boards — but nothing about that site is maintained, so treat every figure as needing confirmation.
High-layer-count PCB · HDI and any-layer · Quick-turn prototype · IC substrate and SLP · FPC and rigid-flex · all six on capability by process.