The short answer. Three plants claim substrate-class work: Suntak, whose Jiangsu IC-substrate plant publishes 15,000 m²/month for phone, wearable and PC substrates; Kinwong, whose Zhuhai SLP and IC-substrate factory is described as at full production; and Yingchuangli, which lists 载板 (carrier/substrate) as a product family with a separate substrate plant on its Suining site.
The number that shows the scale gap. Suntak publishes 15,000 m²/month for substrate and 240,000 m²/month for its multilayer plant. Same company, same page, sixteen times the area — which is roughly the ratio between a board business and a substrate business, and the reason a PCB plant’s new substrate line is not automatically a substrate supply.
| Plant | What is claimed | Capacity published | What is missing |
|---|---|---|---|
| Suntak 崇达技术 · 002815 · ¥7.54bn | 江苏IC载板厂 — IC substrate for phone, wearable and PC, listed as one of nine factories with its own monthly figure | 15,000 m²/mo | Line/space, layer count, substrate type (BT or ABF), and any package qualification |
| Kinwong 景旺电子 · 603228 / 03228 · ¥15.31bn | SLP (substrate-like PCB for smartphones) plus a Zhuhai SLP and IC-substrate factory reported at full production | None | Everything quantitative — no area, no line/space, no layer count for the substrate line |
| Yingchuangli 英创力 · IQE · ¥1.359bn | 载板 listed among five product families, with a dedicated substrate plant on its 212-mu Suining site; also announced a 1.6T optical-module board in January 2026 | None | Capacity, line/space, layer count, substrate type |
Thirteen plants do not claim substrate work at all. That includes the two largest board makers in the directory by revenue, which is not a gap in their capability so much as a statement about where substrate sits in the value chain: it is a separate business with separate customers, and most board plants buy substrates rather than make them.
SLP — substrate-like PCB — is a board process pushed to substrate-like geometry. It is used for the mainboard of a high-end phone, where the routing density needs line/space in the 20–30 µm class and a modified semi-additive process. It is called “substrate-like” precisely because it is not a substrate: the material is still a PCB laminate, the panel is still a PCB panel, and the customer is a phone assembler rather than a package house.
An IC substrate carries a bare die. It is built on BT or ABF dielectric, its line/space is measured in single-digit micrometres, its critical parameters are warpage and dimensional stability across reflow, and it is qualified by the package’s own qualification route — which involves the OSAT or the chip company, not the PCB buyer. A plant that can run SLP has demonstrated fine-line capability; it has not demonstrated that it can supply a substrate for a flip-chip package.
Why the distinction is worth a paragraph. Three plants here use substrate language and one of them publishes a number. If your requirement is a phone mainboard at high density, Kinwong’s SLP line is the relevant fact. If your requirement is a package substrate, you need a supplier whose customer list includes an OSAT — and none of the sixteen publishes one.
Substrate capacity is measured in square metres like board capacity, but the numbers are an order of magnitude apart for a reason: a substrate panel is smaller, the yield is lower, and the price per square metre is higher by a factor that reflects both. Suntak’s 15,000 m²/month against 240,000 m²/month for multilayer is the clearest published illustration of that ratio in this directory, and it comes from the one company that publishes per-factory capacity at all.
What no plant publishes is the shape of the substrate business: which package types, which layer counts (a typical substrate runs 2–10 build-up layers, a different scale from a 20-layer board), what line/space is in production rather than in a sample, and which customers have qualified the line. Those four facts decide whether a substrate supplier is relevant to your design.
“IC substrate factory at full production” is a statement about a building. Kinwong’s Zhuhai factory is real and recent; the absence of any figure means a buyer cannot tell whether it runs 2-layer BT substrates for wearables or 10-layer ABF for a processor. Ask for the product matrix before the capability discussion.
Yingchuangli’s substrate plant is on the same site as its board plants. Co-location is a logistics advantage and a qualification question: substrate lines usually need a cleaner environment and a separate quality system. Ask whether the substrate plant holds its own certification, and which one.
No customer is named by any of the three. In substrate work, the customer list is the qualification. A supplier that cannot name an OSAT or a chip company is asking you to be its first, which is a legitimate conversation but a different one from a standard PCB award.
High-layer-count PCB · HDI and any-layer · Quick-turn prototype · Metal-core, ceramic and heavy copper · FPC and rigid-flex · all six on capability by process.